Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs

Published 2008 View Full Article

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Title
Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package With Vertical Feedthroughs
Authors
Keywords
-
Journal
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume 17, Issue 1, Pages 193-200
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2008-02-12
DOI
10.1109/jmems.2007.910258

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