4.5 Article

Pig dorsum model for examining impaired wound healing at the skin-implant interface of percutaneous devices

Journal

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN MEDICINE
Volume 24, Issue 9, Pages 2181-2193

Publisher

SPRINGER
DOI: 10.1007/s10856-013-4975-5

Keywords

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Funding

  1. National Institutes of Health [5RC1AR058356]
  2. Office of Rehabilitation R&D Service, DVA SLC HCS, Salt Lake City, UT
  3. The Albert and Margaret Hofmann Chair
  4. Department of Orthopaedics, University of Utah School of Medicine, Salt Lake City, UT

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Percutaneous medical devices are indispensable in contemporary clinical practice, but the associated incidence of low to moderate mortality infections represents a significant economic and personal cost to patients and healthcare providers. Percutaneous osseointegrated prosthetics also suffer from a similar risk of infection, limiting their clinical acceptance and usage in patients with limb loss. We hypothesized that transepidermal water loss (TEWL) management at the skin-implant interface may improve and maintain a stable skin-to-implant interface. In this study, skin reactions in a 3-month, pig dorsum model were assessed using standard histology, immunohistochemistry, and quantitative image analysis. Immunohistochemical analysis of peri-implant tissue explants showed evidence of: continuous healing (cytokeratin 6+), hypergranulation tissue (procollagen+), hyper-vascularity (collagen 4+), and the presence of fibrocytes (CD45+ and procollagen type 1+). Importantly, the gross skin response was correlated to a previous load-bearing percutaneous osseointegrated prosthetic sheep study conducted in our lab. The skin responses of the two models indicated a potentially shared mechanism of wound healing behavior at the skin-implant interface. Although TEWL management did not reduce skin migration at the skin-implant interface, the correlation of qualitative and quantitative measures validated the pig dorsum model as a high-throughput platform for translational science based percutaneous interface investigations in the future.

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