Effects of Ag particles content on properties of Sn0.7Cu solder

Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging

(2012) Chi-Yang Yu et al.   JOURNAL OF MATERIALS SCIENCE

Critical studies to improve service reliability of Sn–Ag–Cu solder joints by thermal treatments

(2012) Stephanie Bergman et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer

(2011) Jung Kyu Han et al.   ACTA MATERIALIA

Effects of Co additions on electromigration behaviors in Sn–3.0 Ag–0.5 Cu-based solder joint

(2011) Limin Ma et al.   JOURNAL OF MATERIALS SCIENCE

Study on properties of Sn–9Zn–Ga solder bearing Nd

(2011) Peng Xue et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging

(2011) Jun Shen et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

(2011) B.S.S. Chandra Rao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of solidification kinetics on microstructure formation in binary Sn–Cu solder alloys

(2010) Tina Ventura et al.   ACTA MATERIALIA

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

(2010) Asit Kumar Gain et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane

(2010) Ruihong Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder

(2010) T. H. Chuang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Electromigration behaviors in Sb particle-reinforced composite eutectic SnAgCu solder joints

(2009) Fu Guo et al.   JOURNAL OF MATERIALS SCIENCE