Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging

Published 2014 View Full Article

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Title
Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging
Authors
Keywords
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Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 214, Issue 9, Pages 1900-1908
Publisher
Elsevier BV
Online
2014-04-18
DOI
10.1016/j.jmatprotec.2014.04.007

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