Investigation on microstructure and mechanical properties of diffusion bonded Al/Mg2Si metal matrix composite using copper interlayer

Title
Investigation on microstructure and mechanical properties of diffusion bonded Al/Mg2Si metal matrix composite using copper interlayer
Authors
Keywords
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Journal
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume 210, Issue 10, Pages 1282-1289
Publisher
Elsevier BV
Online
2010-03-25
DOI
10.1016/j.jmatprotec.2010.03.015

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