Journal
JOURNAL OF MATERIALS CHEMISTRY
Volume 22, Issue 16, Pages 7954-7960Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c2jm16907j
Keywords
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Funding
- National Research Foundation of Korea (NRF)
- Ministry of Education, Science and Technology [20100013811]
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The hydrosilylation reaction is a dominant curing method for the light-emitting diode (LED) silicone encapsulant, which requires characteristics of high transparency, high refractive index, and thermal stability against the LED junction temperature. In this research, we synthesized a hydrogen containing oligosiloxane resin through non-hydrolytic sol-gel condensation. Methyldiethoxysilane (MDES) and diphenylsilanediol (DPSD) were used as precursors and a non-hydrolytic sol-gel condensation reaction was performed under acidic conditions. The synthesized hydrogen oligosiloxane resin was mixed with a phenyl and vinyl containing oligosiloxane (PVO) resin, which was prepared by a sol-gel condensation between vinyltrimethoxysilane (VTMS) and the DPSD. This blended solution was cured at 150 degrees C for 4 hours to complete the hydrosilylation reaction. The cured material (phenyl hybrimer) shows low shrinkage during the curing reaction and provides excellent transparency (similar to 90% at 450 nm) and thermal stability (440 degrees C) with a high refractive index (n = 1.58 at 632.8 nm).
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