Journal
JOURNAL OF INSTRUMENTATION
Volume 7, Issue -, Pages -Publisher
IOP PUBLISHING LTD
DOI: 10.1088/1748-0221/7/11/P11010
Keywords
Particle tracking detectors; Large detector systems for particle and astroparticle physics; Particle tracking detectors (Solid-state detectors)
Categories
Funding
- NSERC, Canada
- NRC, Canada
- CFI, Canada
- CERN
- MSMT CR, Czech Republic
- MPO CR, Czech Republic
- VSC CR, Czech Republic
- IN2P3-CNRS, France
- BMBF, Germany
- DFG, Germany
- HGF, Germany
- MPG, Germany
- AvH Foundation, Germany
- INFN, Italy
- MEXT, Japan
- JSPS, Japan
- FOM, Netherlands
- NWO, Netherlands
- RCN, Norway
- ARRS, Slovenia
- MVZT, Slovenia
- MICINN, Spain
- SER, Switzerland
- SNSF, Switzerland
- Canton of Bern
- Canton Geneva
- Canton of Switzerland
- NSC, Taiwan
- STFC, United Kingdom
- Royal Society, United Kingdom
- Leverhulme Trust, United Kingdom
- DOE
- NSF, United States of America
- European Commission [262025]
- CERN IC group
- STFC [ST/K50208X/1, ST/H000623/1, ST/J004928/1, ST/G502320/1, PP/E000487/1, ST/I006080/1, ST/F00754X/1, ST/F011571/1, ST/F007418/1, ST/H00095X/1, ST/J501074/1, ST/J004944/1, ST/J005576/1, ST/K000713/1, ST/M000664/1, ST/H00095X/2, ST/I005803/1, PP/E003087/1, ST/I000186/1, ST/K001388/1, ST/I505756/1] Funding Source: UKRI
- ICREA Funding Source: Custom
- Science and Technology Facilities Council [ST/F007418/1, ST/J004928/1 ATLAS Upgrade, ST/H000623/1, ST/J004944/1, ST/H00095X/1, ST/G502320/1, ST/F011571/1, ST/I005803/1, ST/J501074/1, ST/M000664/1, PP/E000487/1, ST/I005803/1 GRIDPP, ST/H00095X/2, ST/J004928/1 ATLAS Upgrades, ST/K50208X/1, ST/I505756/1, ST/F00754X/1, PP/E003087/1, ST/J004928/1, ST/I006080/1, ST/K006142/1 ATLAS Upgrade, ST/K000713/1, ST/J005576/1, ST/K001388/1, ST/I000186/1] Funding Source: researchfish
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The ATLAS collaboration will upgrade its semiconductor pixel tracking detector with a new Insertable B-layer (IBL) between the existing pixel detector and the vacuum pipe of the Large Hadron Collider. The extreme operating conditions at this location have necessitated the development of new radiation hard pixel sensor technologies and a new front-end readout chip, called the FE-I4. Planar pixel sensors and 3D pixel sensors have been investigated to equip this new pixel layer, and prototype modules using the FE-I4A have been fabricated and characterized using 120 GeV pions at the CERN SPS and 4 GeV positrons at DESY, before and after module irradiation. Beam test results are presented, including charge collection efficiency, tracking efficiency and charge sharing.
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