Microencapsulation of imidazole curing agent for epoxy resin

Title
Microencapsulation of imidazole curing agent for epoxy resin
Authors
Keywords
-
Journal
JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY
Volume 16, Issue 5, Pages 728-733
Publisher
Elsevier BV
Online
2010-07-16
DOI
10.1016/j.jiec.2010.07.011

Ask authors/readers for more resources

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started