Article
Thermodynamics
Yuan-Chun Li, Shwin-Chung Wong
Summary: This study presents the design and performance test results of novel ultra-thin vapor chambers, showcasing their advantages such as lower cost, superior thermal performance, and strong anti-compression ability. The paper examines the performance and capillary blocking phenomena of vapor chambers under different thicknesses and filling ratios.
APPLIED THERMAL ENGINEERING
(2021)
Article
Thermodynamics
Shwin-Chung Wong, Yuan-Chun Li, Chun-Yi Sung, Lian-Qi Huang, Chih-Yuan Fu, Chih-chao Hsu
Summary: Ultra-thin vapor chambers (UTVCs) have been widely studied for their thermal management capabilities in thin portable electronic devices. This work presents a novel UTVC design using copper-water materials, which exhibits high heat transfer performance. The thickness and vapor duct thickness of the UTVCs are shown to significantly affect the heat transfer rate and thermal resistance. The use of arrayed pillars in the design provides structural support, an enlarged condensation area, and a direct shortcut for liquid return, contributing to the high performance of the UTVCs.
THERMAL SCIENCE AND ENGINEERING PROGRESS
(2024)
Article
Thermodynamics
Yusuf Rahmatullah, Tsrong-Yi Wen
Summary: This paper proposes a novel numerical scheme for vapor chamber simulations, which takes into account flow compressibility and temperature variations within the vapor core. The scheme uses mass/energy source terms based on the Lee model at liquid-vapor interfaces, and does not require presetting the phase change behavior. The results show good agreement between simulations and experiments, demonstrating the numerical stability and applicability of the proposed scheme.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2023)
Article
Thermodynamics
Hao Su, Fei He, Jianhua Wang, Xiaoguang Luo, Bangcheng Ai
Summary: The study simplifies the mathematical model of liquid transpiration cooling, simulates the cooling process under different conditions, and investigates the effects of different parameters on cooling performance, revealing significant differences in the effects of parameters between liquid and gaseous transpiration cooling.
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
(2021)
Article
Thermodynamics
Li Yi, Fei Duan, Minqiang Pan
Summary: This paper proposes an immersion spray array cooling vapor chamber (ISVC) for high-power electronic devices and conducts experimental and numerical studies on thermal performance and flow pattern. It is shown that increasing the inlet temperature of the coolant facilitates the heat transfer performance and temperature uniformity of the ISVC within the safe working temperature range of electronic devices. The ISVC achieves enhanced heat transfer capacity and temperature uniformity with larger inlet flow rates, compared to existing integrated heat sink combined vapor chamber and array jet impingement. The operating limit heating power of the ISVC is increased by at least 68%.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2023)
Article
Thermodynamics
Zipeng Huang, Qifei Jian
Summary: A lumped parameter model of VC-PEMFC stack system considering cooling subsystem and variable VC configuration is established and verified in this study. The electrical output performance and thermodynamic characteristics are discussed, showing that integrating vapor chambers into the PEMFC stack can effectively reduce the operating temperature but increases the thermal response time.
APPLIED THERMAL ENGINEERING
(2022)
Article
Thermodynamics
Weiping Li, Longjian Li, Wenzhi Cui, Mengting Guo
Summary: The study proposed a compound liquid cooling system combining a grooved aluminum vapor chamber with a one-through flow cold plate for battery thermal management. Experimental results showed that vapor chambers with 20% to 30% filling ratio had the smallest thermal resistance and preferable temperature uniformity in horizontal configuration. The suppression ratio of temperature difference on the heating surface could be achieved at 0.78 under positive tilting angle configuration with the same filling ratio.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2021)
Article
Thermodynamics
Guohui Zhou, Jingzhi Zhou, Xiulan Huai
Summary: The rise of advanced technologies has made thermal management a crucial factor in determining the performance and lifespan of electronic devices. Vapor chambers, as passive heat transfer devices, have attracted attention due to their high thermal conductivity and passive operation. In this study, a novel vapor chamber with a leaf-vein-inspired wick structure was proposed. Experimental results showed that the vapor chamber could effectively handle heat loads ranging from 20 W to 500 W with minimal performance degradation, making it a promising solution for cooling high-power and miniaturized electronics.
APPLIED THERMAL ENGINEERING
(2023)
Article
Thermodynamics
Huawei Wang, Pengfei Bai, Ruipeng Cai, Yuhao Luo, Xingliang Chen, Shixiao Li, Guodong Wu, Yifan Tang, Guofu Zhou
Summary: The hybrid vapor chamber heat sink (HVCHS) incorporates phase change and single-phase heat transfer in a single device, providing high cooling capacity of 1200 W and maintaining a maximum junction temperature of 95.25 degrees C with great temperature uniformity. It has a minimum thermal resistance of 0.04 degrees C/W, minimum pressure drop of 4.83 kPa, and cooling COP above 12,500 for heat inputs of more than 850 W, showing great potential for energy-saving cooling management of high-performance electronics.
ENERGY CONVERSION AND MANAGEMENT
(2021)
Article
Thermodynamics
Li Yi, Chaomeng Chen, Fei Duan, Minqiang Pan
Summary: A designed integrated arrayed spray impingement vapor chamber (ISVC) was tested for cooling high-power electronic devices and compared with two other integrated arrayed jet impingement vapor chambers (IJVCs) with different jet orifice diameters. The results showed that ISVC had better performance in terms of pressure drop, power consumption, heat dissipation, temperature uniformity, and overall performance.
APPLIED THERMAL ENGINEERING
(2023)
Article
Thermodynamics
Wenjie Dong, Peigang Deng, Shuyang Lin, Ting Chen
Summary: Phase change transpiration cooling based on the porous structure is a promising thermal protection technology. A self-adaptive transpiration cooling system, which utilizes the properties of liquid phase change, is proposed in this paper. A mathematical model and numerical strategy are established and validated, and simulations are conducted to evaluate the system's feasibility, reliability, and cooling capability under various operating conditions. The results show that the self-adaptive transpiration cooling system can effectively generate and maintain stable vapor flow and respond timely to heat flow, indicating its high cooling potential.
APPLIED THERMAL ENGINEERING
(2023)
Article
Thermodynamics
Qizhi Yang, Zhiru Hu, Yao Tao, Long Shi, Jiyuan Tu, Jie Chai, Yong Wang
Summary: This study proposes a novel earth-to-air heat exchange system that utilizes an inlet plenum chamber to pre-treat outdoor air for improved performance. Compared to traditional systems, this novel system reduces the fluctuation of outlet air temperature and requires shorter buried pipe length.
ENERGY CONVERSION AND MANAGEMENT
(2023)
Article
Thermodynamics
Tingting Jiang, Shijun You, Zhangxiang Wu, Huan Zhang, Yaran Wang, Shen Wei
Summary: A novel refrigerant-cooling radiant terminal (RCRT) system is proposed to enhance the heat transfer efficiency, with natural convection identified as the main contributor in the heat transfer process. A simplified characteristic equation is provided for convenient evaluation of the cooling performance. The RCRT system shows superior cooling capacity per unit projected area compared to chilled water radiant cooling systems, but inferior to forced-convection air-conditioning systems.
APPLIED THERMAL ENGINEERING
(2021)
Article
Thermodynamics
Feng Zhou, Guohui Zhou, Jingzhi Zhou, Xiulan Huai, Yawen Jiang, Qiang Huang
Summary: An integrated composite wick with multi-artery channels structure was proposed in this research, imitating the Laval nozzle in porosity. The UTVC showed advantages in liquid reflow, vapor diffusion, and supporting the upper and lower covers. Experimental results demonstrated a reduction in maximum temperature difference by 67.7% compared to copper plate, and a minimum spreading resistance of 0.063 degrees C/W under high heat load and cooling air flow rate.
CASE STUDIES IN THERMAL ENGINEERING
(2022)
Article
Thermodynamics
Zhaohui Huang, Xianwen Tang, Qiliang Luo, Yunhua Gan, Jialin Liang, Rui Li, Tang Xiong, Jinlong Liu, Li Ma, Daowei Dong, Yong Li
Summary: A three-dimensional numerical model was established to predict heat transfer characteristics of a multi-vapor channel vapor chamber with a novel composite wick. The model was validated by comparing surface temperatures with experimental results, and investigating the effects of the vapor channel height on velocity, pressure drop, and thermal resistance. The study found that these parameters were inversely correlated to the channel height, and proposed a conduction-based model for determining the effective thermal conductivity of the vapor channel.
CASE STUDIES IN THERMAL ENGINEERING
(2021)