A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler
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Title
A Thermally Conductive Composite with a Silica Gel Matrix and Carbon-Encapsulated Copper Nanoparticles as Filler
Authors
Keywords
Nanostructures, polymer–matrix composites, thermal properties, electrical properties, thermal expansion
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 7, Pages 2759-2769
Publisher
Springer Nature
Online
2014-05-01
DOI
10.1007/s11664-014-3159-5
References
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