Mitigation of Sn Whisker Growth by Small Bi Additions

Thermal stress driven Sn whisker growth: in air and in vacuum

(2013) Jung-Lae Jo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Least lead addition to mitigate tin whisker for ambient storage

(2013) Jung-Lae Jo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

(2012) Cai-Fu Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

(2012) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Sn whisker growth during thermal cycling

(2011) Katsuaki Suganuma et al.   ACTA MATERIALIA

Effect of layer properties on stress evolution, intermetallic volume, and density during tin whisker formation

(2011) Eric Chason et al.   JOM

Optimum Thickness of Sn Film for Whisker Growth

(2011) Jing Cheng et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of humidity on tin whisker growth — Investigated on Ni and Ag underplated layer construction

(2011) Barbara Horváth et al.   THIN SOLID FILMS

Interface flow mechanism for tin whisker growth

(2010) H.P. Howard et al.   ACTA MATERIALIA

Grain refinement of Sn–Pb alloy under a novel combined pulsed magnetic field during solidification

(2010) Junshan Hua et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY