NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples

NiSn4 formation during the solidification of Sn–Ni alloys

(2012) S.A. Belyakov et al.   INTERMETALLICS

Reaction kinetics of Ni/Sn soldering reaction

(2010) Jens Görlich et al.   ACTA MATERIALIA

Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing

(2010) Chao-Hong Wang et al.   INTERMETALLICS

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

(2009) J. Shen et al.   ACTA MATERIALIA

Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

(2009) Yung-Chi Lin et al.   JOURNAL OF ELECTRONIC MATERIALS

Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys

(2009) C. M. Gourlay et al.   JOURNAL OF ELECTRONIC MATERIALS

Interfacial Reaction Between Eutectic Sn-Pb Solder and Electroplated-Ni as well as Electroless-Ni Metallization During Reflow

(2008) Hsiao-Yun Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Cu-Ni-Sn: A Key System for Lead-Free Soldering

(2008) C. Schmetterer et al.   JOURNAL OF ELECTRONIC MATERIALS