Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit

Published 2011 View Full Article

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Title
Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 40, Issue 6, Pages 1335-1344
Publisher
Springer Nature
Online
2011-04-07
DOI
10.1007/s11664-011-1613-1
References
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