Article
Nanoscience & Nanotechnology
Joshua M. Kubiak, Buxuan Li, Mathew Suazo, Robert J. Macfarlane
Summary: The distribution of filler particles within a polymer matrix nanocomposite significantly affects its properties and processability. This study presents a strategy for preparing functional composites with enhanced thermal conductivity. The thermal cross-linking of self-suspended polymer grafted nanoparticles is used to achieve homogeneously dispersed, non-percolating alumina particles in an organic matrix.
ACS APPLIED MATERIALS & INTERFACES
(2022)
Article
Chemistry, Multidisciplinary
G. B. Veeresh Kumar, R. Pramod, R. Hari Kiran Reddy, P. Ramu, B. Kunaal Kumar, Pagidi Madhukar, Murthy Chavali, Faruq Mohammad, Sachin K. Khiste
Summary: The current trend in materials engineering is focused on developing new materials to enhance efficiency in various engineering sectors. Research on Al6061-TiC composites showed that increasing TiC content improved density, hardness, and tensile strength, although elongation percentage decreased. Dry wear testing demonstrated superior wear resistance in these composites compared to pure Al6061.
Article
Materials Science, Ceramics
Hao Chen, Zhenzhen Gui, Xinyun Wang, Xianhui Gao, Dejian Liu
Summary: The use of WC/W2C eutectic reinforcement effectively suppresses the formation of TiC in titanium matrix composites, creating a W solid solution interface at the WC/Ti interface to transfer stress more effectively and prevent the formation of TiC layer, thus avoiding dec cohesion of the W interface.
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
(2022)
Article
Materials Science, Composites
Z. Y. Dong, X. Y. Liu, D. Wang, W. G. Wang, B. L. Xiao, Z. Y. Ma
Summary: A 20 nm SiC nanocoating was prepared on crushed diamond particles using sol-gel and in situ reaction methods. The 50 vol% SiC-coated diamond particles reinforced 6061Al composites were fabricated by vacuum hot pressing. The composite showed improved interfacial thermal conductance due to the presence of SiC at the diamond-Al interface, resulting in a high thermal conductivity of 485 W/mK.
COMPOSITES COMMUNICATIONS
(2023)
Review
Engineering, Manufacturing
Saad Ali, Faiz Ahmad, Puteri Sri Melor Megat Yusoff, Norhamidi Muhamad, Eugenio Onate, Muhammad Rafi Raza, Khurshid Malik
Summary: This review focuses on the enhancement of thermal conductivity of graphene reinforced Cu matrix composites, discussing various factors affecting thermal conductivity and giving special attention to the processing route as the most influential factor. Additionally, graphene-based functional products for heat dissipation of electronic devices are reviewed. The development and outlook for graphene-based Cu composites are also presented.
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
(2021)
Article
Chemistry, Physical
Hao Jia, Jianzhong Fan, Yanqiang Liu, Yuehong Zhao, Junhui Nie, Shaohua Wei
Summary: This study successfully enhanced the interfacial thermal conductance of SiC@Graphite/Al and TiC@Graphite/Al composites by uniformly coating silicon carbide and titanium carbide coatings on the graphite surface. Additionally, the in-plane thermal conductivity of the composites with different volume fractions all exceeded 90% of the predicted values.
Article
Materials Science, Composites
Hyeseong Lee, Mi Na Kim, Han Gyeol Jang, Ji-un Jang, Jaewoo Kim, Seong Yun Kim
Summary: The aggregation of nano-carbon fillers in composites due to van der Waals forces hinders their excellent conductive properties. To overcome this, a dispersion strategy using phenyl glycidyl ether (PGE) as a non-covalent functionalization agent was proposed. The composites filled with PGE-treated nano-carbon fillers showed significantly improved electrical and thermal conductivities.
COMPOSITES COMMUNICATIONS
(2022)
Article
Engineering, Manufacturing
Fubin Luo, Shuguang Yang, Pinping Yan, Hongzhou Li, Baoquan Huang, Qingrong Qian, Qinghua Chen
Summary: Liquid Crystal Polymer (LCP) / hexagonal boron nitride (BN) composites with highly aligned nematic domains and orderly arrangement of BN were manufactured using 3D printing. The composites exhibited high thermal conductivity.
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
(2022)
Article
Materials Science, Ceramics
Xiaoyang Ji, Zhe Cheng, Ella K. Pek, David G. Cahill
Summary: In this study, the thermal conductance of the oxide layer and the thermal conductivity of SiC/SiC composites were mapped with high spatial resolution using time-domain thermoreflectance (TDTR). It was found that the dominant source of noise in the measurements was the input noise of the preamplifier under low laser powers or small integration time constants. The thermal conductance of the oxide on the fiber region was lower than that on the matrix due to slight differences in thickness and thermal conductivity.
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
(2021)
Article
Chemistry, Physical
Zunyue Yu, Zhenrui Chen, Xuepeng Ren, Jianhao Chen, Beibei Zhang, Wenru Zhao, Yang Zhao, Shubin Ren, Xuanhui Qu
Summary: In this study, pure titanium (Ti) and Ti-6Al-4 V (TC4) matrix composites reinforced with 50 vol% graphite flake (GF) were fabricated using spark plasma sintering (SPS). The effects of different matrix and sintering temperatures on the microstructure and thermal conductivity of the composites were investigated. The results showed that the interfacial reaction between the GF and pure Ti or TC4 produced an intermediate layer of titanium carbide (TiC). The sintering temperature had a significant influence on the thickness of the TiC layer and the thermal conductivity of the composites.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Article
Materials Science, Composites
Dan Yang, Qungui Wei, Liyuan Yu, Yufeng Ni, Liqun Zhang
Summary: Functionalized hexagonal boron nitride platelets modified and grafted with bis-(gamma-triethoxysilylpropyl)-tetrasulfide were used to prepare BN-PCPA-Si69/NR composites with significantly improved thermal conductivity, mechanical properties, and dielectric characteristics. The composite with 30% volume content of BN-PCPA-Si69 platelets showed a 5.4-fold increase in thermal conductivity and a maximum tensile strength of 17.0 MPa.
COMPOSITES SCIENCE AND TECHNOLOGY
(2021)
Article
Materials Science, Composites
Patcharapon Somdee, Manauwar Ali Ansari, Kalman Marossy
Summary: In this study, flexible and rigid polyurethane/copper composites were prepared via a simple solution casting process. The dispersion and chemical bonding of the filler were investigated, and the thermal properties and mechanical properties of the composites were analyzed. The results showed that the thermal conductivity of the composites was significantly improved compared to the pure polyurethane, and the mechanical properties were also enhanced. The study suggests that copper microparticles can serve as an active filler in both flexible and rigid polyurethane matrices.
POLYMER COMPOSITES
(2023)
Article
Chemistry, Physical
Fei Qiang, Shewei Xin, Ping Guo, Hongmiao Hou, Jia Wang, Wentao Hou
Summary: The 10 vol% Al0.6CoCrFeNi high entropy alloy particles reinforced titanium matrix composites were successfully fabricated by hot pressing sintering under vacuum. The formation mechanism of interdiffusion layer and mechanical properties of the composites were studied. The results showed that the interdiffusion layers composed of AlNi2Ti (BCC) and Ni-Ti mixed phases (FCC) were formed between the HEA particles and the matrix. The compressive strength of the composites was significantly higher than that of the pure titanium samples.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Article
Chemistry, Physical
Cheng Yang, Lehua Qi, Wenlong Tian, Xujiang Chao, Jian Ge
Summary: A strategy for preparing short carbon fiber preform without any chemical binder through vacuum filtration is proposed. High in-plane and nearly unaltered out-plane thermal conductive magnesium matrix composites have been prepared using the liquid-solid extrusion following vacuum infiltration technique. The composites exhibit excellent thermal properties and provide an efficient approach to prepare short fiber-related thermal conductive metal matrix composites.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Review
Materials Science, Composites
Yanfei Xu, Xiaojia Wang, Qing Hao
Summary: The trend towards miniaturization in electronic devices has led to unprecedented power densities but also poses a bottleneck for device performance. Polymer-based materials play a crucial role in effective cooling of electronic devices, with the potential to enhance thermal conductivity through strain-induced crystallization and high-conductivity fillers.
COMPOSITES COMMUNICATIONS
(2021)
