Journal
JOURNAL OF COMPOSITE MATERIALS
Volume 46, Issue 7, Pages 773-781Publisher
SAGE PUBLICATIONS LTD
DOI: 10.1177/0021998311410496
Keywords
Polyhedral oligomeric silsesquioxane; polyimide; glass transition temperature; thermal stability; char yield
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Funding
- University Grants Commission (UGC), Government of India, New Delhi
- Department of Chemical Engineering, Alagappa College of Technology, Anna University, Chennai
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Polyhedral oligomeric silsesquioxane (POSS)-siloxane-modified polyimide (PI) hybrid nanocomposites were prepared by the reaction of siloxane-modified polyamic acid (PAA) with octaaminophenylsilsesquioxane (OAPS). PAA was prepared by the reaction of 4,4-diaminodiphenylsulfone with pyromellitic dianhydride in N-methylpyrrolidone (NMP), followed by the reaction of PAA with bis(3-aminopropyl) polydimethylsiloxane to obtain siloxane-modified. The siloxane-modified PI was further blended with varying weight percentages of OAPS using NMP solution. The reactions occurred during the formation of hybrid nanocomposites were confirmed by Fourier transform infrared spectra. The siloxane-modified PI OAPS nanocomposites were characterized for their thermal properties using differential scanning calorimeter and by thermogravimetric analysis. Morphological studies of the nanocomposites indicate that the incorporation of siloxane moieties creates heterogeneous morphology. Data from thermal studies indicate that the incorporation of POSS appreciably enhanced the glass transition temperature, thermal stability, and char yield of hybrid nanocomposites compared to neat PI.
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