Journal
JOURNAL OF APPLIED POLYMER SCIENCE
Volume 124, Issue 4, Pages 3363-3371Publisher
WILEY-BLACKWELL
DOI: 10.1002/app.35332
Keywords
para-aramid; electroless silver plating; silver weight gain percentage; surface morphology; growth morphology
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Funding
- National Natural Science Foundation of China (NFSC) [51103083]
- Shanghai Leading Academic Discipline Project [s30107]
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The development of a conductive fiber with flame resistance is an urgent concern particularly in national defense and other specialized fields. Aramid fibers (para- or meta-) exihibit high strength and excellent fire resistance. Electroless silver plating on para-aramid fibers and growth morphology of silver deposits was investigated in the present work. The surface of para-aramid fibers was roughened using sodium hydride/dimethyl sulfoxide to guarantee successful electroless plating. Two complexing agents (ethylene diamine/ammonia) and two reducing agents (glucose/seignette salt) were used for the electroless silver plating bath design. Structure and properties of the resulting silver-deposited para-aramid fibers were evaluated based on scanning electron microscopy, silver weight gain percentage calculation, electrical resistance measurement, crystal structure analysis, and mechanical properties test. The results showed that a higher silver weight gain was advantageous to the improvement of conductivity for the silver-deposited para-aramid fibers. The obtained silver deposit was homogenous and compact. Electroless silver-plating deposits were considered to be three-dimensional nucleation and growth model (VolmerWeber). Black, silver gray, and white deposits appeared sequentially with progressive plating. The breaking strength of silver-deposited para-aramid fibers remained at value up to 44 N. (C) 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012
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