High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction

Published 2010 View Full Article

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Title
High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
Authors
Keywords
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Journal
JOURNAL OF APPLIED PHYSICS
Volume 107, Issue 6, Pages 063502
Publisher
AIP Publishing
Online
2010-03-18
DOI
10.1063/1.3309750
References
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