Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy

Title
Investigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 103, Issue 7, Pages 073506
Publisher
AIP Publishing
Online
2008-04-03
DOI
10.1063/1.2890995

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