Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress

Title
Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 104, Issue 4, Pages 044511
Publisher
AIP Publishing
Online
2008-09-02
DOI
10.1063/1.2973154

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