Effect of additive and current mode on surface morphology of palladium films from a non-aqueous deep eutectic solution (DES)

Electrodeposition of palladium films from ionic liquid (IL) and deep eutectic solutions (DES): physical–chemical characterisation of non-aqueous electrolytes and surface morphology of palladium deposits

(2013) G Lanzinger et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Pulse plating of tantalum from 1-butyl-1-methyl-pyrrolidinium bis(trifluoromethylsulfonyl)amide ionic liquids

(2012) A Ispas et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Pulse current electrodeposition of Al from an AlCl3-EMIC ionic liquid

(2011) Bing Li et al.   ELECTROCHIMICA ACTA

Electrodeposition of Co, Sm and SmCo from a Deep Eutectic Solvent

(2011) E. Gómez et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Using deep eutectic solvents to electrodeposit CoSm films and nanowires

(2011) P. Cojocaru et al.   MATERIALS LETTERS

Optimization of pulsed electrodeposition of aluminum from AlCl3-1-ethyl-3-methylimidazolium chloride ionic liquid

(2010) Jinwei Tang et al.   ELECTROCHIMICA ACTA

Electrodeposition of Palladium–Tin Alloys from 1-Ethyl-3-methylimidazolium Chloride–Tetrafluoroborate Ionic Liquid for Ethanol Electro-Oxidation

(2010) Li-Hsien Jou et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Zinc Electrodeposition from a Deep Eutectic System Containing Choline Chloride and Ethylene Glycol

(2010) Adam H. Whitehead et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition

(2009) N. Imaz et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Electrodeposition of zinc–nickel alloy by pulse plating using non-cyanide bath

(2009) S. Mohan et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Electrodeposition of iron films from an ionic liquid (ChCl/urea/FeCl3deep eutectic mixtures)

(2009) R. Böck et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Electrodeposition of nickel using eutectic based ionic liquids

(2008) A. P. Abbott et al.   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING