Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni–Si–B ternary filler alloy

Title
Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni–Si–B ternary filler alloy
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 563, Issue -, Pages 143-149
Publisher
Elsevier BV
Online
2013-02-28
DOI
10.1016/j.jallcom.2013.02.100

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