Reversible “Wetting” of grain boundaries by the second solid phase in the Cu-In system

Title
Reversible “Wetting” of grain boundaries by the second solid phase in the Cu-In system
Authors
Keywords
Contact Angle, JETP Letter, Solubility Limit, Phase Layer, Complete Wetting
Journal
JETP LETTERS
Volume 100, Issue 8, Pages 535-539
Publisher
Pleiades Publishing Ltd
Online
2015-01-06
DOI
10.1134/s0021364014200107

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