Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line

Title
Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line
Authors
Keywords
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Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 53, Issue 6S, Pages 06JC05
Publisher
Japan Society of Applied Physics
Online
2014-05-30
DOI
10.7567/jjap.53.06jc05

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