Fabrication and Noise Reduction of the Miniature Tactile Sensor Using Through-Silicon-Via Connection with Signal Amplifier

Published 2013 View Full Article

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Title
Fabrication and Noise Reduction of the Miniature Tactile Sensor Using Through-Silicon-Via Connection with Signal Amplifier
Authors
Keywords
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Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 52, Issue 6S, Pages 06GL08
Publisher
IOP Publishing
Online
2013-06-20
DOI
10.7567/jjap.52.06gl08

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