Effects of Wafer Precleaning and Plasma Irradiation to Wafer Surfaces on Plasma-Assisted Surface-Activated Direct Bonding

Published 2010 View Full Article

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Title
Effects of Wafer Precleaning and Plasma Irradiation to Wafer Surfaces on Plasma-Assisted Surface-Activated Direct Bonding
Authors
Keywords
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Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 49, Issue 8, Pages 086204
Publisher
Japan Society of Applied Physics
Online
2010-08-20
DOI
10.1143/jjap.49.086204

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