Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects

Published 2010 View Full Article

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Title
Numerical Analysis of Vacancy Transport by Residual Stress in Electromigration on LSI Interconnects
Authors
Keywords
-
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 49, Issue 2, Pages 024301
Publisher
Japan Society of Applied Physics
Online
2010-02-22
DOI
10.1143/jjap.49.024301

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