Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating

Published 2009 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Copper Multilayer Interconnection Using Ultravaiolet Nanoimprint Lithography with a Double-Deck Mold and Electroplating
Authors
Keywords
-
Journal
JAPANESE JOURNAL OF APPLIED PHYSICS
Volume 48, Issue 11, Pages 115001
Publisher
Japan Society of Applied Physics
Online
2009-11-20
DOI
10.1143/jjap.48.115001

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.