Analyses of crack growth along interface of patterned wafer-level Cu–Cu bonds

Published 2009 View Full Article

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Title
Analyses of crack growth along interface of patterned wafer-level Cu–Cu bonds
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
Volume 46, Issue 18-19, Pages 3433-3440
Publisher
Elsevier BV
Online
2009-05-30
DOI
10.1016/j.ijsolstr.2009.05.015

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