Vapor compression refrigeration cycle for electronics cooling – Part I: Dynamic modeling and experimental validation

Published 2013 View Full Article

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Title
Vapor compression refrigeration cycle for electronics cooling – Part I: Dynamic modeling and experimental validation
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 66, Issue -, Pages 911-921
Publisher
Elsevier BV
Online
2013-08-06
DOI
10.1016/j.ijheatmasstransfer.2013.06.075

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