Inductively coupled plasma etching of tapered via in silicon for MEMS integration

Title
Inductively coupled plasma etching of tapered via in silicon for MEMS integration
Authors
Keywords
Inductively coupled plasma (ICP), Deep silicon etch, Tapered via, Through silicon via, Micro-electro-mechanical systems (MEMS)
Journal
MICROELECTRONIC ENGINEERING
Volume 141, Issue -, Pages 261-266
Publisher
Elsevier BV
Online
2015-04-13
DOI
10.1016/j.mee.2015.03.071

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