Inductively coupled plasma etching of tapered via in silicon for MEMS integration

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Inductively coupled plasma etching of tapered via in silicon for MEMS integration
Authors
Keywords
Inductively coupled plasma (ICP), Deep silicon etch, Tapered via, Through silicon via, Micro-electro-mechanical systems (MEMS)
Journal
MICROELECTRONIC ENGINEERING
Volume 141, Issue -, Pages 261-266
Publisher
Elsevier BV
Online
2015-04-13
DOI
10.1016/j.mee.2015.03.071

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.