Effect of 4-point bending test procedure on crack propagation in thin film stacks

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Title
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Authors
Keywords
4 point bending, FEM modeling, Symmetric/asymmetric crack propagation, G, c, variation, Cohesive/adhesive failure, Crack path variation
Journal
MICROELECTRONIC ENGINEERING
Volume 137, Issue -, Pages 59-63
Publisher
Elsevier BV
Online
2014-09-28
DOI
10.1016/j.mee.2014.09.006

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