4.7 Article

High heat flux flow boiling in silicon multi-microchannels - Part I: Heat transfer characteristics of refrigerant R236fa

Journal

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 51, Issue 21-22, Pages 5400-5414

Publisher

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2008.03.006

Keywords

Flow boiling; Microchannel; High heat flux; Chip cooling; Refrigerant

Funding

  1. Swiss Federal Office for Professional Education and Technology (KTI) [6862.2 DCS-NM]

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This article is the first in a three part study on flow boiling of refrigerants R236fa and R245fa in a silicon multi-microchannel heat sink. The heat sink was composed of 67 parallel channels, which are 223 mu m wide, 680 pm high and 20 mm long with 80 pm thick fins 2 2 separating the channels. The base heat flux was varied from 3.6 to 221 W/cm(2), the mass velocity from 281 to 1501 kg/m(2) and the exit vapour quality from 2% to 75%. The working pressure and saturation temperature were set nominally at 273 kPa and 25 degrees C, respectively. The present database includes 1217 local heat transfer coefficient measurements, for which three different heat transfer trends were identified, but in most cases the heat transfer coefficient increased with heat flux and was almost independent of vapour quality and mass velocity. Importantly, it was found for apparently the first time that the heat transfer coefficient as a function of vapour quality reaches a maximum at very high heat fluxes and then decreases with further increase of heat flux. (C) 2008 Elsevier Ltd. All rights reserved.

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