Study on polyblending epoxy resin adhesive with lignin I-curing temperature

Published 2013 View Full Article

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Title
Study on polyblending epoxy resin adhesive with lignin I-curing temperature
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 48, Issue -, Pages 75-79
Publisher
Elsevier BV
Online
2013-09-26
DOI
10.1016/j.ijadhadh.2013.09.003

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