Effect of the evolution of phenol–formaldehyde resin on the high-temperature bonding

Title
Effect of the evolution of phenol–formaldehyde resin on the high-temperature bonding
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 29, Issue 7, Pages 718-723
Publisher
Elsevier BV
Online
2009-04-20
DOI
10.1016/j.ijadhadh.2009.03.001

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