Recent advances in isotropic conductive adhesives for electronics packaging applications

Published 2007 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Recent advances in isotropic conductive adhesives for electronics packaging applications
Authors
Keywords
-
Journal
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
Volume 28, Issue 7, Pages 362-371
Publisher
Elsevier BV
Online
2007-11-10
DOI
10.1016/j.ijadhadh.2007.10.004

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.