Experimental investigation on paraffin wax integrated with copper foam based heat sinks for electronic components thermal cooling

Title
Experimental investigation on paraffin wax integrated with copper foam based heat sinks for electronic components thermal cooling
Authors
Keywords
-
Journal
Publisher
Elsevier BV
Online
2018-09-24
DOI
10.1016/j.icheatmasstransfer.2018.08.003

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