Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification

Title
Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn–Ag solder during solidification
Authors
Keywords
-
Journal
INTERMETALLICS
Volume 16, Issue 9, Pages 1142-1148
Publisher
Elsevier BV
Online
2008-08-13
DOI
10.1016/j.intermet.2008.06.016

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