Millimeter wave wireless interconnects in deep submicron chips: Challenges and opportunities

Published 2018 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Millimeter wave wireless interconnects in deep submicron chips: Challenges and opportunities
Authors
Keywords
-
Journal
INTEGRATION-THE VLSI JOURNAL
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2018-09-26
DOI
10.1016/j.vlsi.2018.09.004

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.