Bonding of spruce wood with wheat flour glue—Effect of press temperature on the adhesive bond strength

Published 2010 View Full Article

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Title
Bonding of spruce wood with wheat flour glue—Effect of press temperature on the adhesive bond strength
Authors
Keywords
-
Journal
INDUSTRIAL CROPS AND PRODUCTS
Volume 31, Issue 2, Pages 255-260
Publisher
Elsevier BV
Online
2010-01-20
DOI
10.1016/j.indcrop.2009.11.001

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