Integrated Algorithm for 3-D IC Through-Silicon Via Assignment

Published 2013 View Full Article

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Title
Integrated Algorithm for 3-D IC Through-Silicon Via Assignment
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume 22, Issue 3, Pages 655-666
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-03-12
DOI
10.1109/tvlsi.2013.2246876
References
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