Microstructure evolution and mechanical properties of copper bonding wire during continuous annealing

Published 2015 View Full Article

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Title
Microstructure evolution and mechanical properties of copper bonding wire during continuous annealing
Authors
Keywords
-
Journal
MATERIALS RESEARCH INNOVATIONS
Volume 19, Issue sup4, Pages S225-S229
Publisher
Informa UK Limited
Online
2015-05-26
DOI
10.1179/1432891715z.0000000001563

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