Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects

Title
Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 60, Issue 7, Pages 2338-2345
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-06-12
DOI
10.1109/ted.2013.2264217

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