A New TDDB Reliability Prediction Methodology Accounting for Multiple SBD and Wear Out

Title
A New TDDB Reliability Prediction Methodology Accounting for Multiple SBD and Wear Out
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 56, Issue 7, Pages 1424-1432
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2009-06-03
DOI
10.1109/ted.2009.2021810

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