A Tight-Binding Study of the Ballistic Injection Velocity for Ultrathin-Body SOI MOSFETs

Title
A Tight-Binding Study of the Ballistic Injection Velocity for Ultrathin-Body SOI MOSFETs
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume 55, Issue 3, Pages 866-871
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2008-03-01
DOI
10.1109/ted.2007.915056

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now