Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management

Published 2008 View Full Article

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Title
Three-Dimensional Chip-Multiprocessor Run-Time Thermal Management
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
Volume 27, Issue 8, Pages 1479-1492
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2008-07-25
DOI
10.1109/tcad.2008.925793

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