Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging

Published 2010 View Full Article

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Title
Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging
Authors
Keywords
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Journal
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
Volume 33, Issue 2, Pages 340-346
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2010-03-02
DOI
10.1109/tcapt.2009.2038366

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