Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology

Title
Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION
Volume 61, Issue 4, Pages 1581-1590
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2013-01-26
DOI
10.1109/tap.2013.2242827

Ask authors/readers for more resources

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started