Review of Packaging of Optoelectronic, Photonic, and MEMS Components

Published 2011 View Full Article

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Title
Review of Packaging of Optoelectronic, Photonic, and MEMS Components
Authors
Keywords
-
Journal
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Volume 17, Issue 3, Pages 704-719
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2011-04-07
DOI
10.1109/jstqe.2011.2113171

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