Passive Alignment and Mounting of LiNbO$_3$ Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au

Published 2011 View Full Article

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Title
Passive Alignment and Mounting of LiNbO$_3$ Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of Au
Authors
Keywords
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Journal
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
Volume 17, Issue 3, Pages 652-658
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2011-02-19
DOI
10.1109/jstqe.2010.2093871

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