Journal
LAB ON A CHIP
Volume 15, Issue 9, Pages 1998-2001Publisher
ROYAL SOC CHEMISTRY
DOI: 10.1039/c5lc00174a
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Funding
- Danish Council for Strategic Research through the Strategic Research Centre Poly-Nano [10-092322/DSF]
- Danish Council for Independent Research [09066477]
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Ultrasonic welding is a rapid, promising bonding method for the bonding of polymer chips; yet its use is still limited. We present two lab-on-a-chip applications where ultrasonic welding can be preferably applied: (1) self-aligned gapless bonding of a two-part chip with a tolerance of 50 mu m; (2) bonding of a large area shallow chamber (1.8 cm(2) x 150 mu m). Using injection moulding combined with ultrasonic welding we achieved a total production and bonding time of 60 s per chip, and a batch of chips could be produced within a day going from design to finished chips. We believe that the technical solutions offered here can significantly help bridge the gap between academia and industry, where the differences in production methods and materials pose a challenge when transferring technology.
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